JPH0412682Y2 - - Google Patents

Info

Publication number
JPH0412682Y2
JPH0412682Y2 JP1987027816U JP2781687U JPH0412682Y2 JP H0412682 Y2 JPH0412682 Y2 JP H0412682Y2 JP 1987027816 U JP1987027816 U JP 1987027816U JP 2781687 U JP2781687 U JP 2781687U JP H0412682 Y2 JPH0412682 Y2 JP H0412682Y2
Authority
JP
Japan
Prior art keywords
spacer
chip
base
lead frame
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1987027816U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63136344U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987027816U priority Critical patent/JPH0412682Y2/ja
Publication of JPS63136344U publication Critical patent/JPS63136344U/ja
Application granted granted Critical
Publication of JPH0412682Y2 publication Critical patent/JPH0412682Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
JP1987027816U 1987-02-26 1987-02-26 Expired JPH0412682Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987027816U JPH0412682Y2 (en]) 1987-02-26 1987-02-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987027816U JPH0412682Y2 (en]) 1987-02-26 1987-02-26

Publications (2)

Publication Number Publication Date
JPS63136344U JPS63136344U (en]) 1988-09-07
JPH0412682Y2 true JPH0412682Y2 (en]) 1992-03-26

Family

ID=30830201

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987027816U Expired JPH0412682Y2 (en]) 1987-02-26 1987-02-26

Country Status (1)

Country Link
JP (1) JPH0412682Y2 (en])

Also Published As

Publication number Publication date
JPS63136344U (en]) 1988-09-07

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